InvenSense's Chirp's MEMS-based ultrasonic ultrasonic leverage a lokaci-of-flight (ToF) firikwensin kewayawa tare da mai sarrafa ingantaccen siginar dijital (DSP) ASIC a cikin kunshin 3.5 mm x 3.5 mm. Mai firikwensin yana ɗaukar nau'ikan ayyukan sarrafa siginar ultrasonic da algorithms, yana bawa abokan ciniki damar zaɓuɓɓukan ƙirar masana'antu don ɗimbin yanayin amfani da yanayin, gami da binciken zangon, kasancewa da fahimtar kusanci, gano abu da kaucewa, da kuma bin wuri .
Plementaddamar da ƙaramin ƙaramin C10p ƙaramin CH101 ultrasonic ToF firikwensin samfurin, CH201 yana ba da cikakkun ma'aunin kewayon ƙira zuwa nesa har zuwa 5 m. Amfani da ma'aunin ultrasonic, firikwensin yana aiki a cikin kowane yanayi mai haske, daga cikakken hasken rana zuwa ƙarshen duhu, kuma yana samar da ma'aunin ma'auni na millimita daidai ba tare da launi mai manufa da haske na gani ba. Za'a iya daidaita yanayin kallon firikwensin firikwensin (FoV) kuma yana ba da damar auna ma'aunin lokaci ɗaya zuwa abubuwa da yawa a cikin FoV.
| Hoto | Lambar Sashin Ma'aikata | Bayani | Ya Rasu Quantity | Duba Bayanai | |
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